Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

Cadence Design Systems has started infusing artificial intelligence (AI) into its flagship suite of chip design software to help chip designers build better chips faster than they could alone. Now, it ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in semiconductor technology, today announced that it has started initial production of its 3-nanometer (nm) process ...

The video game Fortnite has gathered a global audience of millions with a simple proposition: One of the game’s modes enables players to build virtual spaces and easily experience them with others. It ...

Two companies are joining forces to make the home design process a little less stressful for homebuyers and builders. Walk Your Plans projects residential and commercial floor plans at full scale on a ...

Mobile apps place information, entertainment and access to services at the fingertips of users, and they provide an unmatched way for businesses to reach current and potential customers 24/7, wherever ...